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LS-DYNA Kompakt: Introduction to Welding Simulation (2 Teile)

Recent developments in LS-DYNA target to close the virtual process chain with respect to the thermal-mechanical coupled process steps such as line welding and resistance spot weld. In this webinar most of these developments are discussed. New boundary conditions and contact algorithms for the thermal and the structure solver of LS-DYNA are introduced that provide a flexible and comfortable framework to set up welding simulations. Furthermore, the webinars covers coupling approaches for the transfer of temperature fields to a structure simulation and also tailored material models for the process.

Content:
1)  Simulating the temperature field during welding
- Brief introduction to the thermal solver in LS-DYNA
- Thermal material models tailored for welding  applications
- Thermal boundary conditions for weld source modeling
- Modeling heat conductance between the parts in the welding process

2) Thermal-mechanical coupled welding simulations
- Introduction of coupling approaches between thermal and structure solver in LS-DYNA
- Structure material models tailored for welding applications, possibly including evolution of the microstructure
- Welding contact

 

Termine:
Teil 1: 29. Juni, 15-17 Uhr
Teil 2: 30. Juni, 15-17 Uhr

Teil 1: 10. Dezember, 9-11 Uhr
Teil 2: 11. Dezember. 9-11 Uhr

Termine
Termine Dauer/Tage Anmeldung Trainer Sprache(n) Ort Gebühr
29.06.2020
2 Tage Thomas Klöppel Englisch 400 €
10.12.2020
2 Tage Anmeldung Thomas Klöppel Englisch 400 €

Tutoren

Thomas Klöppel

Thomas Klöppel

Dr.-Ing.

Spezialgebiete:
Composites, Schweißprozesse, Thermische Umformprozesse

Studium:
Mathematik